Taiflex Scientific’s expertise lies in the research and production of the flexible copper-cladded laminate for the flexible printed circuit industry. Its main product lines include the flexible copper-cladded laminate (FCCL), cover layer, PV module backsheet and optical film material. This year the company will join the Taiwan Pavilion, introducing its latest products.
The Intersolar North America tradeshow scheduled to be held on July 08-10 in San Francisco. A ‘Taiwan Pavilion’ is staged for the fair on Level 1, West Hall at the Moscone Center (Booth 7245), featuring a wide range of solar solutions. Welcome to visit!
For more information, please visit company website: www.taiflex.com.tw